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Single-sided with ED Cu foil
Published:2014-07-04 13:47?Author:admin?Visits:
Our main products are polyimide(PI) film based 3 layers Flexible Copper Clad Laminate(3L-FCCL),also known as Copper Clad Laminate with adhesive.

Product Specifications:
Base Film: PI (Polyimide) film
Thickness of PI: 0.5/1mil (12.5/25um)
Thickness of copper foil: 12um-35um
Construction: Single/Double-sided
* Halogen-free 
* Excellent dip soldering resistance
* High bond and peel strength
* Good chemical resistance
* Good dimensional stability
* Excellent dielectric properties
* Good flammability and UL94 V-0

Technical Index:
Item Unit Condition Spec Control Value Test method
Thickness μm As received +/-20% +/-10% Hongyang  Spec
Width mm As received +/-1 +/-0.5 Hongyang  Spec
Peel strength As Received N/mm  
≥0.7 ≥1.2  
Chemical Resistance(MEK10min) ≥0.6 ≥1.0
Dip soldering resistance 10sec 288*10S 320*10S IPC-TM-650 2.4.13
MIT (500g. 0.8R) Times RA Cu 100-300 ≥1000 JISC-6471
Dimensional Stability Method BMD/TD % B.after etching
+/-0.15 ≤+/-0.1 IPC-TM-650 2.2.4.
Method CMD/TD +/-0.2 ≤+/-0.1
Water Absorption % 2.00 ≤1.00 IPC TM 650 2.6.2
Insulation Resistance Surface Ω Ω C-96/23/65 107 1012 IPC-TM-650 2.5.17
Volume Ω-cm 109 1013
Bear Medicine Character
mm IPA 1.0 Visual inspection  
IPC-TM 650 2.3.2
2mol/L HCL
2mol/L  NaOH
Halogen Free ppm RoHS Cl+Br<900ppm 465 SGS
UL Flame Class Grade V-0 pass pass UL94 V-0
Shelf life months 28≤65% 12 12 Hongyang Spec

The above figures are typical data, not guaranteed data. 
Remark: we can manufacture meterials according to the request of user.