Our main products are polyimide(PI) film based 3 layers Flexible Copper Clad Laminate(3L-FCCL),also known as Copper Clad Laminate with adhesive.

Product Specifications：
Base Film: PI (Polyimide) film
Thickness of PI: 0.5/1mil (12.5/25um)
Thickness of copper foil: 12um-35um
Construction: Single/Double-sided
 
Features：
* Halogen-free 
* Excellent dip soldering resistance
* High bond and peel strength
* Good chemical resistance
* Good dimensional stability
* Excellent dielectric properties
* Good flammability and UL94 V-0
Technical index:

Item			Unit	Condition	Spec	Control Value	Test method
Thickness			μm	As received	+/-20%	+/-10%	Hongyang  Spec
Width			mm	As received	+/-1	+/-0.5	Hongyang  Spec
Peel strength	As Received		N/mm	90opeel	≥0.7	≥1.2	IPC-TM-650 2.4.9
	Chemical Resistance(MEK10min)				≥0.6	≥1.0
Dip soldering resistance			℃	10sec	288℃*10S	320℃*10S	IPC-TM-650 2.4.13
MIT (500g. 0.8R)			Times	RA Cu	100-300	≥1000	JISC-6471
Dimensional Stability		Method BMD/TD	%	B.after etching C.150℃/30min	+/-0.15	≤+/-0.1	IPC-TM-650 2.2.4.
		Method CMD/TD			+/-0.2	≤+/-0.1
Water Absorption			%	∕	≤2.00	≤1.00	IPC TM 650 2.6.2
Insulation Resistance		Surface Ω	Ω	C-96/23/65	≥107	≥1012	IPC-TM-650 2.5.17
		Volume Ω-cm			≥109	≥1013
Bear Medicine Character			mm	IPA	1.0↓	Visual inspection	IPC-TM 650 2.3.2
				2mol/L　HCL
				2mol/L  NaOH
Halogen Free			ppm	RoHS	Cl+Br<900ppm	465	SGS
UL Flame Class			Grade	V－0	pass	pass	UL94 V－0
Shelf life			months	≤28℃≤65%	12	12	Hongyang Spec